使用雷射光束分析儀需要將雷射能量適當的衰減,在感測器接近飽和的狀態下量測,如果對雷射光束分析有任何疑問,歡迎與我們聯繫。
適用於焦點分析之即時雷射光束品質分析儀
Model:
S-BMS2 | 4XY 3XYE |
Si IGA DD DD(2300) DD(2500) |
4XY: 100,200,500,750 3XYE: 50,100 |
Specification | Detail |
---|---|
Wavelength | Si detector: 190 to 1150 nm InGaAs detector: 650 to 1800 nm Si + InGaAs detectors: 190 to 1800 nm Si + InGaAs (extended) detectors: 190 to 2300 or 2500 nm |
Scanned Beam Diameters | Si detector: 5 µm to 4 mm, to 2 µm in Knife-Edge mode* InGaAs detector: 10 µm to 3 mm, to 2 µm in Knife-Edge mode* InGaAs (extended) detector: 10 µm to 2 mm, to 2 µm in Knife-Edge mode* |
Plane Spacing (4XY models) | 100 µm: -100, 0, +100, +400 µm 250 µm: -250, 0, +250, +1000 µm 500 µm: -500, 0, +500, +2000 µm 750 µm: -750, 0, +750, +3000 µm |
Plane Spacing (3XYKE models) | 50 µm: -50, 0, +50, 0 µm 100 µm: -100, 0, +100, 0 µm |
Beam Waist Diameter Measurement | Second moment (4s) diameter to ISO 11146; Fitted Gaussian & TopHat 1/e² (13.5%) width User selectable % of peak Knife-Edge mode* for very small beams |
Beam Waist Position Measurement | ± 20 µm best in X, Y, and Z — contact DataRay for recommendation |
Measured Sources | CW; Pulsed lasers, F µm = [500/(PRR in kHz)] |
Resolution Accuracy | 0.1 µm or 0.05% of scan range ± < 2% ± = 0.5 µm |
M² Measurement | 1 to > 20, ± 5% |
Divergence/Collimation, Pointing | 1 mrad best — contact DataRay for recommendation |
Maximum Power & Irradiance | 1 W Total & 0.5 mW/µm² |
Gain Range | 1,000:1 Switched 4,096:1 ADC range |
Displayed Graphics | X-Y-Z Position & Profiles, Zoom x1 to x16 |
Update Rate | ~5 Hz |
Pass/Fail Display | On-screen selectable Pass/Fail colors. Ideal for QA & Production. |
Averaging | User selectable running average (1 to 8 samples) |
Statistics | Min., Max., Mean, Standard Deviation Log data over extended periods |
XY Profile & Centroid | Beam Wander display and logging |
Minimum PC Requirements | Windows, 2 GB RAM, USB 2.0/3.0 port |
* Knife-Edge mode requires 3XYKE model Product specifications are subject to change without notice |