雷射光束品質分析儀

即時雷射光束品質(M^2)分析儀

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我要詢價

即時雷射光束品質分析儀是同時以狹縫掃描四個不同平面的方式，彙整出得四個不同平面的雷射空間能量分佈影像，可即時的取得光束品質因子M²值，不需要搭配平移台，同時也可即時量測雷射的焦點(光束腰部)位置、光束發散角與準直度，且非常小巧，適合在狹小的空間使用。

使用雷射光束分析儀需要將雷射能量適當的衰減，在感測器接近飽和的狀態下量測，如果對雷射光束分析有任何疑問，歡迎與我們聯繫。

適用於平行光之即時雷射光束品質分析儀
Model:
S-BMS2-CM3-Si-10
S-BMS2-CM4-Si-5
S-BMS2-CM3-IGA-10
S-BMS2-CM4-IGA-5

Specification	Detail
Wavelength	Si detector: 190 to 1150 nm InGaAs detector: 650 to 1800 nm Si + InGaAs detectors: 190 to 1800 nm Si + InGaAs (extended) detectors: 190 to 2300 or 2500 nm
Scanned Beam Diameters	Si detector: 5 µm to 4 mm, to 2 µm in Knife-Edge mode* InGaAs detector: 10 µm to 3 mm, to 2 µm in Knife-Edge mode* InGaAs (extended) detector: 10 µm to 2 mm, to 2 µm in Knife-Edge mode*
Plane Spacing (CM4 models)	5 mm: -5, 0, +5, +20 mm
Plane Spacing (CM3 models)	10 mm: -10, 0, +10, 0 mm
Beam Waist Diameter Measurement	Second moment (4s) diameter to ISO 11146; Fitted Gaussian & TopHat 1/e² (13.5%) width User selectable % of peak Knife-Edge mode* for very small beams
Beam Waist Position Measurement	± 20 µm best in X, Y, and Z — contact DataRay for recommendation
Measured Sources	CW; Pulsed lasers, Φ µm ≥ [500/(PRR in kHz)]
Resolution Accuracy	0.1 µm or 0.05% of scan range ± < 2% ± = 0.5 µm
M² Measurement	1 to > 20, ± 5%
Divergence/Collimation, Pointing	1 mrad best — contact DataRay for recommendation
Maximum Power & Irradiance	1 W Total & 0.5 mW/µm²
Gain Range	1,000:1 Switched 4,096:1 ADC range
Displayed Graphics	X-Y-Z Position & Profiles, Zoom x1 to x16
Update Rate	~5 Hz
Pass/Fail Display	On-screen selectable Pass/Fail colors. Ideal for QA & Production.
Averaging	User selectable running average (1 to 8 samples)
Statistics	Min., Max., Mean, Standard Deviation Log data over extended periods
XY Profile & Centroid	Beam Wander display and logging
Minimum PC Requirements	Windows, 2 GB RAM, USB 2.0/3.0 port
* Knife-Edge mode requires CM3 model Product specifications are subject to change without notice